Heraeus Electronics magiCu PE401 represents a significant advancement in die-attach technology. As a copper pressure sinter paste that is free of silver (Ag-free), magiCu PE401 sets a new standard for materials used in power electronics. This innovative formulation addresses the challenges faced in the manufacturing of power electronic devices, providing a reliable, efficient, and high-performance solution.
magiCu PE401 is designed to optimize the die-attach process with its low sintering temperature of 260°C and a short sintering time of just 5 minutes. Additionally, the paste can be used for wet die placement processes. These features enable manufacturers to significantly improve throughput and reduce cycle times, enhancing overall production efficiency. Additionally, magiCu PE401 ensures consistent and reliable joint formation, contributing to the quality and reliability of power electronic devices.
With excellent thermal conductivity and compatibility with standard production processes, magiCu PE401 delivers high-performance die-attach solutions that meet the stringent quality standards demanded by the industry. This innovative sinter paste not only supports the development of more reliable and robust connections, but enhances the efficiency of manufacturing operations.
Since 2005, the prestigious Global Technology Awards have recognized the absolute best new innovations in the printed circuit assembly and packaging industries. It brings together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward.
